VIA Boasts Growing Support for the Mini-ITX Form Factor from Motherboard and Chassis Manufacturers
May 27, 2002

Taipei, Taiwan, April 12, 2002, - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced growing industry support for its ultra compact Mini-ITX form factor, with the introduction of a range of exciting small footprint chassis designs and Mini-ITX motherboards from leading case and motherboard manufacturers.

The ultra compact Mini-ITX form factor was introduced by VIA in November 2001 as part of VIA's open industry-wide Total Connectivity initiative. The Mini-ITX is more than 33% smaller than the FlexATX form factor and VIA launched its own VIA EPIA Mini-ITX mainboard in March this year following the phenomenal interest and excitement over the fanless VIA Eden™ Platform and the VIA Mini-ITX form factor. The VIA EPIA Mini-ITX comes with a rich feature set that includes a low power x86 processor, onboard AGP graphics and audio, TV-Out, Ethernet networking and USB 1.1 that are currently not available on other small form factor motherboards.

"With the availability of the Mini-ITX, manufacturers now have the right platform to bring to market uniquely small, quiet and fanless designs that were previously inconceivable," states Richard Brown, Director of International Marketing at VIA Technologies, Inc. "The positive feedback from motherboard and chassis designers and manufacturers demonstrates the growing momentum behind the Mini-ITX and VIA Eden Platform designs."

Read the full press release here

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