VIA Showcases Innovative Low Power VIA Eden™ and Mini-ITX Embedded Platforms at CeBIT 2002
May 27, 2002

Taipei, Taiwan, 11th March 2002 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced that it will display the full range of Total Connectivity platforms and devices at its booth (Stand D23 in Hall 19) at CeBIT 2002 in Hannover, Germany, from 13 - 20 March 2002.

In addition to the highly integrated, low power VIA Eden™ Embedded System Platform and the new ultra compact Mini-ITX motherboard form factor, highlights include the Company's Information Station, Set Top Box, Tablet PC, and Web Pad reference systems, as well as innovative embedded platform and system solutions from leading industry partners such as Nexcom, Advantech, AAEON, ECS, and Microstar.

"With our ultra low power VIA Eden™ Platform and the highly compact Mini-ITX motherboard form factor, VIA is spearheading the development of an exciting new breed of fanless, quiet running small footprint 'Total Connectivity' devices," commented Richard Brown, Director of Marketing for VIA Technologies, Inc. "The large number of innovative solutions we have on display at CeBIT clearly demonstrates the growing momentum of this high potential segment of the market."

Read the full press release here

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